01
2026-04
KIOXIA has officially announced the end-of-life for a wide range of NAND flash products, with production ceasing across ...
31
2026-03
Japan’s advanced semiconductor maker Rapidus aims to narrow the gap with TSMC in 1nm process to around six months, as st...
30
2026-03
Samsung Electronics has begun mass production of V8 (236-layer) 3D NAND flash at its Xi’an, China wafer fab, following a...
27
2026-03
3PEAK has introduced the TPW4020DQ , a dual-channel intelligent high-side switch designed for automotive body control. A...
23
2026-03
The global foundry landscape for gallium nitride (GaN) is shifting. TSMC has confirmed plans to fully exit GaN wafer pro...
20
2026-03
Infineon has launched its 600V CoolGaN™ Drive HB G5 series, packing a complete half-bridge power stage with two 600V Coo...
19
2026-03
Raytron Microelectronics, a subsidiary of leading Chinese infrared detector maker Raytron Technology, has launched the O...
18
2026-03
Fortior Technology, a key domestic MCU manufacturer, has officially announced a price adjustment for its chip products, ...
17
2026-03
On March 12, Silicon Motion launched the SM8008 controller chip —a PCIe Gen5 solution engineered specifically for data c...
16
2026-03
On March 16, Taiwan-based semiconductor company PSMC officially announced the completion of its $1.8 billion sale of the...
13
2026-03
Broadcom has unveiled the Taurus BCM83640 , the industry's first 3nm optical PAM4 DSP designed for next-generation AI ne...
13
2026-03
Broadcom has unveiled the Taurus BCM83640 , the industry's first 3nm optical PAM4 DSP designed for next-generation AI ne...
